

Need reflow oven equipment for your operations? Drop us an enquiry with your requirements and we’ll get back to you with recommended options and cost estimates. The new flux filtration box also has no risk of flux clogging for a longer-term P.M. SPC (statistical process control) in the electronics manufacturing business helps assess if the process is under control, as measured against the reflow parameters established by soldering technologies and component requirements. Our reflow oven has a revolutionary flux collection system that traps the flux in collection jars which can be easily removed and replaced while the reflow soldering oven is running saving time consuming P.M. Thermal profiling is the practice of measuring many places on a circuit board to detect the thermal excursion that occurs during the soldering process.

This is sometimes referred to as condensation soldering. The boiling point of the medium limits the highest temperature that assembly can attain.There is no need for any protective gas (e.g., nitrogen), and there is no risk of assembly overheating. Because of the high heat transfer coefficient of vapour phase medium, it has a high energy efficiency.

The following are some advantages of vapour phase soldering: The liquid used is chosen with the proper boiling point in mind for the solder alloy to be reflowed in mind. The heating of the PCBs is provided by thermal energy generated by the phase transition of a heat transfer liquid (e. As a result, nitrogen ovens often keep nitrogen infusion running at all times, which reduces failure rates. It takes a few minutes for the nitrogen reflow oven to lower the oxygen concentration within the chamber to acceptable limits. This reduces oxidation on the soldering surfaces. Nitrogen (N2) is a popular gas for this purpose. Hheat is emitted by ceramic heat element with infrared radiation, but it. Some ovens are made to reflow PCBs in an oxygen-free environment. The modern solder reflow oven use the concepts of radiation and convection combined. Ovens that employ both infrared radiative heating and convection heating are referred to as ‘infrared convection’ ovens. Because PCBs and components differ in infrared absorptance, indirect heating using air allows for more precise temperature control than direct heating with infrared radiation. They may be fan-assisted in order to adjust airflow within the oven. The heat source in infrared reflow ovens is typically ceramic infrared heaters above and below the conveyor, which deliver heat to the PCBs by radiation.Ĭonvection ovens heat air in chambers, which is then used to transmit heat to PCBs by convection and conduction. Types of reflow ovens Convection and infrared ovens The profile used may change based on the needs of the PCBs being processed at the moment. To obtain a given time and temperature profile, technicians modify the conveyor speed and zone temperatures. PCBs are treated at a regulated rate as they pass through the oven and each zone. In commercial high-volume application, reflow ovens have the shape of a lengthy tunnel with a conveyor belt that transports PCBs.Ĭommercial conveyorised reflow ovens include numerous separately heated zones that may be individually temperature adjusted.
